ATMI RegenSi Silicon Process Efficiency Solutions
RegenSi Silicon Process Efficiency solutions offer compelling value propositions focused on reducing the overall cost of silicon for manufacturers. RegenSi solutions are adept at removing most films commonly used in the industry at a higher rate than commodities, such as dilute HF, while leaving the Si wafer surface extremely smooth. This high selectivity for metal and non-metal films over the silicon substrate enables the minimization, and possible elimination, of wafer polishing. By minimizing polish-induced silicon loss, wafers can be re-used more times resulting in substantial cost savings.
RegenSi Wafer Reclaim Solutions products are formulated as ready to use solutions; no dilution of the products is required or recommended. The products can to be used in either batch immersion, batch spray or single wafer applications, and can often be implemented as a simple drop-in alternative to products currently in use.
Through an exclusive relationship with a leading test wafer reclaim supplier, ATMI is now able to offer the benefits of RegenSi technology for both internal and external test wafer requirements.
In Our Customer's Words
"ATMI's unique RegenSi process technology complements the excellent wafer reclaim capabilities Kinik already has. It brings great value and benefits to customers, and improves our internal process efficiency by reducing the required wafer removal amount and extending the wafer lifetime. Additionally, the collaboration enables us to ensure we are meeting the next generation wafer reclaim needs of the premier customers in the global semiconductor industry."
— Thomas Hsieh, General Manager of Kinik's Semiconductor Materials business unit