Schedule Your Next Breakthrough
Let ATMI cut your R&D time and costs - and reduce your integration risk - by adding wafer-scale combinatorial science to your problem-solving process.
As the limits of pure scaling are being reached, new materials are being integrated into leading-edge devices in order to drive performance. Introduction of these new materials using conventional development methods is costly and time consuming. Moreover, it poses a substantial risk to IC manufacturing - especially for high volume production. High Productivity Development, a capability of global process technology leader ATMI, overcomes these problems and delivers low-risk solutions to complex materials and process integration challenges with greater speed, effectiveness and efficiency. So much so, in fact, ATMI is changing the way companies are thinking about their research and development costs and windows.
An exciting new addition to to the ATMI arsenal, High Productivity Development utilizes combinatorial methods for materials discovery, unit process development and device integration. The company’s experience combined with these capabilities bring the unique ability to provide massively parallel experimentation for materials screening, process window characterization, device integration and performance optimization. This lab-to-fab capability allows ATMI to execute many cycles for learning quickly and dramatically increases your rate of knowledge acquisition, allowing an early anticipation of your next breakthrough.
This new ability to accelerate learning is augmented by a decades-long ATMI core capability in interfacial science. As layer thicknesses shrink, the interfaces more significantly impact device performance. Understanding interfacial interactions enables the creation of custom-engineered material solutions. Combining interface science with High Productivity Development allows these solutions to be delivered quickly and cost effectively. Moreover, the data processing and analysis capability provided enables knowledge-rich, data-driven decisions for new material choices. ATMI has deployed this capability worldwide, with two labs in the U.S. and two in Asia (Taiwan and Japan) for global access.
ATMI is already addressing several process integration challenges leveraging this capability. It has developed an all-wet formulation for stripping highly-dosed photoresist without the need for a plasma ashing step. In addition, ATMI has developed a non-selective oxide etch that can strip native oxide from high aspect ratio contact surfaces at a rate that is approximately equal to the etch rate of the less dense ILD. Also available is a production-ready copper post-CMP cleaning solution that dramatically lowers copper surface roughness to meet the 45nm and beyond resistivity requirements.
In each case, thousands of experimental runs were performed in just a matter of weeks - and at a fraction of the cost of conventional methods.
In all, the new High Productivity Development capability enables new materials and processes to be integrated into high-volume manufacturing process flows in a controlled, low-risk fashion while substantially lowering costs of R&D and accelerating time to qualification. If you want to schedule your next breakthrough, contact ATMI today.
