Copper Integration
ATMI and its alliance partner Enthone, Inc. are acknowledged leaders for copper electroplating materials and processes in semiconductor development and manufacturing. For more than a decade, ATMI and Enthone have been innovating and implementing Viaform® copper processes for the industry's leading copper fabs.
In addition, and as a leader in formulated chemistry, ATMI also focuses on the total copper integration scheme with post-CMP cleaning solutions developed using the ATMI High Productivity Development capability. This capability uses knowledge-rich, combinatorial science experiments to delivery the best possible solution. One such outcome is PlanarClean, a new post-CMP cleaning solution. Moreover, ATMI is in full development of a brand new way to deliver the CMP process. The CMPlicity System will deliver unmatched process control and improve yield and throughput.
From Viaform®, the industry's leading copper electroplating process, to CMPlicity™ to PlanarClean™ post-CMP clean solutions, ATMI is working to continue to bring efficiency to copper processing and copper integration.
